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EPT DIN 41612 90° connector strip, Type C Part No. 103-60064

SKU: EPT 103-60064 Category:

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Description

EPT DIN 41612 90° connector strip, Type C Part No. 103-60064

Technical Specifications

Basics

Specification IEC 60603-2 (DIN 41612)
Performance Level 2
No. of Contacts 96
Termination Technology Press-fit technology
Termination Length 3.4 mm
Operating Temperature Range -55°C to +125°C

Material

Insulator Material Glass-fiber-reinforced PBT, UL 94 V-0
CTI value
IEC 60112		 200
Contact Material copper alloy

Mechanical

Pitch 2.54 mm
Mating Force 90 N
Separating Force per Pin > 0.15 N
Durability 400 insertion cycles

Electrical

Operational Current 2.6 A
Test Voltage 1000 V
Contact Resistance 20 mΩ
Clearance and Creepage ≥ 1.2 mm
Insulation Resistance >106 MΩ

Approval / Compliance

UL file E130314
Environment RoHS compliant

Derating Diagram

Hole Specifications

lochspezifikationen bemassungen
Material chem. Sn Leiterplatten
Nennloch Ø 1.0 mm
A Leiterplattendicke min. 1.44 mm
B Endloch Ø 1.0 +0.09 / -0.06 mm
C Grundbohrung 1.15 ±0.025 mm
D Cu Schicht min. 25 µm
E Oberfläche chem. Sn Schicht, max. 1.5 µm
F Restring min. 0.1 mm
Material Ni, Au Leiterplatten
Nennloch Ø 1.0 mm
A Leiterplattendicke min. 1.44 mm
B Endloch Ø 1.0 +0.09 / -0.06 mm
C Grundbohrung 1.15 ±0.025 mm
D Cu Schicht min. 25 µm
E Oberfläche Ni, Au Schicht, 0.05 – 0.2 µm Au über 2.5 – 5 µm Ni
F Restring min. 0.1 mm
Material rein Cu Leiterplatten
Nennloch Ø 1.0 mm
A Leiterplattendicke min. 1.44 mm
B Endloch Ø 1.0 +0.09 / -0.06 mm
C Grundbohrung 1.15 ±0.025 mm
D Cu Schicht min. 25 µm
E Oberfläche OSP, z.B. GLICOAT-SMD (F2) mit 0.12 – 0.15 µm
F Restring min. 0.1 mm
Material HAL Sn Leiterplatten
Nennloch Ø 1.0 mm
A Leiterplattendicke min. 1.44 mm
B Endloch Ø 1.0 +0.09 / -0.06 mm
C Grundbohrung 1.15 ±0.025 mm
D Cu Schicht min. 25 µm
E Oberfläche HAL Sn, 5 – 15 µm
F Restring min. 0.1 mm

Plated through-hole according to IEC 60352-5